P89LPC9321FA
vs
P89LPC932BA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
LCC
Package Description
PLASTIC, MS-018, SOT261-2, LCC-28
QCCJ, LDCC28,.5SQ
Pin Count
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
Address Bus Width
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
18 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-PQCC-J28
S-PQCC-J28
JESD-609 Code
e3
Length
9 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
26
Number of Terminals
28
28
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC28,.5SQ
LDCC28,.5SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
245
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
768
768
ROM (words)
8192
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.57 mm
Speed
18 MHz
12 MHz
Supply Current-Max
23 mA
18 mA
Supply Voltage-Max
3.6 V
Supply Voltage-Min
3 V
Supply Voltage-Nom
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin (Sn)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
1
2
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