P8087-2
vs
MD8087-2/BQA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEL CORP
ROCHESTER ELECTRONICS LLC
Package Description
DIP,
CERAMIC, DIP2-40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
20
20
Boundary Scan
NO
NO
Bus Compatibility
80188
Clock Frequency-Max
8 MHz
8 MHz
External Data Bus Width
16
16
JESD-30 Code
R-PDIP-T40
R-CDIP-T40
Length
52.26 mm
Number of Terminals
40
40
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HMOS
NMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
Rohs Code
No
ECCN Code
3A001.A.2.C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-PRF-38535 Class Q
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare P8087-2 with alternatives
Compare MD8087-2/BQA with alternatives