P8087-2 vs MD8087-2/BQA feature comparison

P8087-2 Intel Corporation

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MD8087-2/BQA Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Package Description DIP, CERAMIC, DIP2-40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 20 20
Boundary Scan NO NO
Bus Compatibility 80188
Clock Frequency-Max 8 MHz 8 MHz
External Data Bus Width 16 16
JESD-30 Code R-PDIP-T40 R-CDIP-T40
Length 52.26 mm
Number of Terminals 40 40
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology HMOS NMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 1 1
Rohs Code No
ECCN Code 3A001.A.2.C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-PRF-38535 Class Q
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare MD8087-2/BQA with alternatives