P4C1256-20FSMB vs 5962-9318707H4X feature comparison

P4C1256-20FSMB Pyramid Semiconductor Corporation

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5962-9318707H4X White Microelectronics

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP WHITE MICROELECTRONICS
Part Package Code DFP
Package Description CERAMIC, FP-28 HERMETIC SEALED, CERAMIC, HIP-66
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 35 ns
Additional Feature LG-MAX USER CONFIGURABLE AS 512K X 8
JESD-30 Code R-CDFP-F28 S-CHIP-P66
JESD-609 Code e0
Length 18.796 mm
Memory Density 262144 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 28 66
Number of Words 32768 words 131072 words
Number of Words Code 32000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B MIL-STD-883
Seated Height-Max 3.302 mm
Supply Current-Max 0.17 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form FLAT PIN/PEG
Terminal Pitch 1.27 mm
Terminal Position DUAL HEX
Width 10.16 mm
Base Number Matches 2 1
Alternate Memory Width 16

Compare P4C1256-20FSMB with alternatives

Compare 5962-9318707H4X with alternatives