P4C1256-20FSMB
vs
5962-9318706H4X
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
AEROFLEX PLAINVIEW
|
Part Package Code |
DFP
|
PGA
|
Package Description |
CERAMIC, FP-28
|
PGA,
|
Pin Count |
28
|
66
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
20 ns
|
45 ns
|
Additional Feature |
LG-MAX
|
CONFIGURABLE AS 512K X 8
|
JESD-30 Code |
R-CDFP-F28
|
S-CPGA-P66
|
JESD-609 Code |
e0
|
|
Length |
18.796 mm
|
|
Memory Density |
262144 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
CACHE SRAM MODULE
|
Memory Width |
8
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
66
|
Number of Words |
32768 words
|
131072 words
|
Number of Words Code |
32000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
32KX8
|
128KX32
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
PGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLATPACK
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
MIL-STD-883
|
Seated Height-Max |
3.302 mm
|
4.699 mm
|
Supply Current-Max |
0.17 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
|
Terminal Form |
FLAT
|
PIN/PEG
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
PERPENDICULAR
|
Width |
10.16 mm
|
|
Base Number Matches |
2
|
1
|
Alternate Memory Width |
|
16
|
|
|
|
Compare P4C1256-20FSMB with alternatives
Compare 5962-9318706H4X with alternatives