P4C1256-12CCLF vs P4C1256L-25TMLF feature comparison

P4C1256-12CCLF Pyramid Semiconductor Corporation

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P4C1256L-25TMLF Pyramid Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP TSOP
Package Description 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 8 X 13.40 MM, ROHS COMPLIANT, PLASTIC, TSOP-28
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 25 ns
JESD-30 Code R-CDIP-T28 R-PDSO-G28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm 1.1938 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.55 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 8.001 mm
Base Number Matches 1 1
JESD-609 Code e3
Length 11.811 mm
Supply Current-Max 0.165 mA
Terminal Finish MATTE TIN

Compare P4C1256-12CCLF with alternatives

Compare P4C1256L-25TMLF with alternatives