P4C1256L-25TMLF vs P4C1256L-12CMLF feature comparison

P4C1256L-25TMLF Pyramid Semiconductor Corporation

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P4C1256L-12CMLF Pyramid Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code TSOP DIP
Package Description 8 X 13.40 MM, ROHS COMPLIANT, PLASTIC, TSOP-28 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 12 ns
JESD-30 Code R-PDSO-G28 R-CDIP-T28
JESD-609 Code e3
Length 11.811 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSOP1 DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1938 mm 5.715 mm
Supply Current-Max 0.165 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.55 mm 2.54 mm
Terminal Position DUAL DUAL
Width 8.001 mm 7.62 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare P4C1256L-25TMLF with alternatives

Compare P4C1256L-12CMLF with alternatives