P4C1256-12CCLF vs P4C1256L-12SSI feature comparison

P4C1256-12CCLF Pyramid Semiconductor Corporation

Buy Now Datasheet

P4C1256L-12SSI Pyramid Semiconductor Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 0.300 INCH, PLASTIC, SOP-28
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
JESD-30 Code R-CDIP-T28 R-PDSO-G28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm 2.794 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.5057 mm
Base Number Matches 1 1
JESD-609 Code e0
Length 17.9324 mm
Terminal Finish Tin/Lead (Sn85Pb15)

Compare P4C1256-12CCLF with alternatives

Compare P4C1256L-12SSI with alternatives