OR2C12A4BA256-DB
vs
XC3164A-2TQ144C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
XILINX INC
Part Package Code
BGA
QFP
Package Description
PLASTIC, BGA-256
PLASTIC, TQFP-144
Pin Count
256
144
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAXIMUM USABLE GATES 35800
MAX USABLE 4500 LOGIC GATES
Clock Frequency-Max
500 MHz
323 MHz
Combinatorial Delay of a CLB-Max
2.2 ns
2.2 ns
JESD-30 Code
S-PBGA-B256
S-PQFP-G144
Length
27 mm
20 mm
Moisture Sensitivity Level
3
3
Number of CLBs
324
224
Number of Equivalent Gates
15600
3500
Number of Inputs
223
120
Number of Logic Cells
1296
224
Number of Outputs
223
120
Number of Terminals
256
144
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
324 CLBS, 15600 GATES
224 CLBS, 3500 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFQFP
Package Equivalence Code
BGA256,20X20,50
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.32 mm
1.6 mm
Supply Voltage-Max
3.6 V
5.25 V
Supply Voltage-Min
3 V
4.75 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
20 mm
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn85Pb15)
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