OR2C12A4BA256-DB
vs
XC3020-100PQ100I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
XILINX INC
Part Package Code
BGA
QFP
Package Description
PLASTIC, BGA-256
QFP, QFP100,.7X.9
Pin Count
256
100
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAXIMUM USABLE GATES 35800
256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA
Clock Frequency-Max
500 MHz
100 MHz
Combinatorial Delay of a CLB-Max
2.2 ns
7 ns
JESD-30 Code
S-PBGA-B256
R-PQFP-G100
Length
27 mm
20 mm
Moisture Sensitivity Level
3
3
Number of CLBs
324
64
Number of Equivalent Gates
15600
1000
Number of Inputs
223
64
Number of Logic Cells
1296
64
Number of Outputs
223
64
Number of Terminals
256
100
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
324 CLBS, 15600 GATES
64 CLBS, 1000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
QFP
Package Equivalence Code
BGA256,20X20,50
QFP100,.7X.9
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.32 mm
2.87 mm
Supply Voltage-Max
3.6 V
5.5 V
Supply Voltage-Min
3 V
4.5 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
14 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
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