NVT2010BS,115 vs NVT2010PW,118 feature comparison

NVT2010BS,115 NXP Semiconductors

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NVT2010PW,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN TSSOP2
Package Description HVQFN-24 TSSOP-24
Pin Count 24 24
Manufacturer Package Code SOT616-1 SOT355-1
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 17 Weeks 16 Weeks
Samacsys Manufacturer NXP NXP
Additional Feature TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE
Delay-Max 0.375 ns 0.375 ns
Input Characteristics STANDARD STANDARD
Interface IC Type GTL TO TTL TRANSCEIVER GTL TO TTL TRANSCEIVER
JESD-30 Code S-PQCC-N24 R-PDSO-G24
Length 4 mm 7.8 mm
Moisture Sensitivity Level 1 1
Number of Bits 10 10
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Latch or Register NONE NONE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Equivalence Code LCC24,.16SQ,20 TSSOP24,.25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max 5.4 V 5.4 V
Supply Voltage-Min
Supply Voltage1-Max 5.5 V 5.5 V
Supply Voltage1-Min
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4 mm 4.4 mm
Base Number Matches 1 1
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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