NVT2002DP
vs
GTL2002DP/Q900
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
TSSOP,
|
TSSOP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Additional Feature |
|
Also required VDREF 0 to 5.5V
|
| Interface IC Type |
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
|
S-PDSO-G8
|
| JESD-609 Code |
|
e4
|
| Length |
|
3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
|
| Supply Voltage1-Max |
|
5.5 V
|
| Supply Voltage1-Min |
|
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
3 mm
|
|
|
|
Compare NVT2002DP with alternatives
Compare GTL2002DP/Q900 with alternatives