NE555F vs SE555P feature comparison

NE555F NXP Semiconductors

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SE555P Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count 14 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code R-CDIP-T14 R-PDIP-T8
JESD-609 Code e0 e4
Number of Functions 1 1
Number of Terminals 14 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max (Isup) 15 mA 15 mA
Supply Voltage-Max (Vsup) 16 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer Texas Instruments
Additional Feature CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY
Length 9.81 mm
Seated Height-Max 5.08 mm
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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