NE555F
vs
LM556CM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Package Description
DIP, DIP14,.3
SOP-14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e3
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Part Package Code
SOIC
Pin Count
14
Additional Feature
CAN ALSO OPERATE AT 15V NOMINAL
Analog IC - Other Type
PULSE; RECTANGULAR
Length
8.56 mm
Moisture Sensitivity Level
1
Number of Functions
2
Seated Height-Max
1.8 mm
Supply Voltage-Max (Vsup)
16 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Width
3.95 mm
Compare LM556CM with alternatives