NE555F
vs
UPD5555C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SIGNETICS CORP
RENESAS ELECTRONICS CORP
Package Description
DIP, DIP14,.3
0.300 INCH, PLASTIC, DIP-8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Analog IC - Other Type
PULSE; RECTANGULAR
PULSE; RECTANGULAR
JESD-30 Code
R-CDIP-T14
R-PDIP-T8
JESD-609 Code
e0
e0
Number of Functions
1
1
Number of Terminals
14
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-20 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max (Isup)
15 mA
Supply Voltage-Max (Vsup)
16 V
16 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Surface Mount
NO
NO
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
Output Frequency-Max
0.5 MHz
Seated Height-Max
5.08 mm
Width
7.62 mm
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