NC7WB66K8X
vs
74LVC2G66DC-Q100
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NEXPERIA
|
| Part Package Code |
VSOP
|
|
| Package Description |
3.10 MM, MO-187, US-8
|
,
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
8LD, US8, JEDEC MO-187, 2.3MM WIDE
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e3
|
e4
|
| Length |
2.3 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Normal Position |
NO
|
|
| Number of Channels |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Off-state Isolation-Nom |
55 dB
|
|
| On-state Resistance Match-Nom |
0.5 Ω
|
|
| On-state Resistance-Max (Ron) |
20 Ω
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VSSOP
|
|
| Package Equivalence Code |
TSSOP8,.12,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.9 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
2.3 V
|
|
| Surface Mount |
YES
|
|
| Switch-off Time-Max |
6.9 ns
|
|
| Switch-on Time-Max |
5.6 ns
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2 mm
|
|
| Base Number Matches |
2
|
2
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare NC7WB66K8X with alternatives
Compare 74LVC2G66DC-Q100 with alternatives