74LVC2G66DC-Q100
vs
FSA266K8X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS INC
Package Description
,
VSSOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Analog IC - Other Type
SPST
SPST
Moisture Sensitivity Level
1
1
Screening Level
AEC-Q100
Base Number Matches
2
3
Pbfree Code
Part Package Code
TSSOP
Pin Count
8
JESD-30 Code
R-PDSO-G8
JESD-609 Code
e3
Length
2.3 mm
Number of Channels
1
Number of Functions
2
Number of Terminals
8
Off-state Isolation-Nom
55 dB
On-state Resistance Match-Nom
0.5 Ω
On-state Resistance-Max (Ron)
20 Ω
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
VSSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
COMMERCIAL
Seated Height-Max
0.9 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
2.3 V
Surface Mount
YES
Switch-off Time-Max
6.9 ns
Switch-on Time-Max
5.6 ns
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2 mm
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