NB4N527SMNR2
vs
NB4N527SMNG
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ONSEMI
|
| Part Package Code |
QFN
|
QFN16, 3x3, 0.5P
|
| Package Description |
3 X 3 MM, QFN-16
|
QFN-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
| JESD-609 Code |
e0
|
|
| Length |
3 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
0.47 ns
|
0.47 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
53 mA
|
53 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL GOLD PALLADIUM
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
485G-01
|
| Factory Lead Time |
|
43 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Moisture Sensitivity Level |
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare NB4N527SMNR2 with alternatives
Compare NB4N527SMNG with alternatives