N82HS321AF vs N82HS321ANB feature comparison

N82HS321AF NXP Semiconductors

Buy Now Datasheet

N82HS321ANB Signetics

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SIGNETICS CORP
Part Package Code DIP
Package Description DIP, DIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code R-CDIP-T24 R-PDIP-T24
Memory Density 32768 bit 32768 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 4KX8 4KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Operating Temperature-Max 75 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.6
Supply Current-Max 0.175 mA
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

Compare N82HS321AF with alternatives

Compare N82HS321ANB with alternatives