N82HS321AF vs 82HS321B/BJA feature comparison

N82HS321AF Philips Semiconductors

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82HS321B/BJA YAGEO Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS PHILIPS COMPONENTS
Package Description DIP, DIP24,.6 ,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code R-XDIP-T24 R-CDIP-T24
JESD-609 Code e0
Memory Density 32768 bit 32768 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4KX8 4KX8
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.175 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Number of Functions 1
Operating Mode ASYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial PARALLEL
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

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Compare 82HS321B/BJA with alternatives