N74LV74N
vs
N74LV175PWDH-T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP,
TSSOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDIP-T14
R-PDSO-G16
Length
19.025 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
4
Number of Functions
2
1
Number of Terminals
14
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
33 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
4.4 mm
fmax-Min
48 MHz
20 MHz
Base Number Matches
1
1
Compare N74LV74N with alternatives
Compare N74LV175PWDH-T with alternatives