N74LV74N
vs
PI74STEX2G74UEX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
PERICOM SEMICONDUCTOR CORP
Package Description
DIP,
TSSOP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
STEX
JESD-30 Code
R-PDIP-T14
S-PDSO-G8
Length
19.025 mm
3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
1
Number of Terminals
14
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
33 ns
13 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
NO
YES
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
3 mm
fmax-Min
48 MHz
250 MHz
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
MSOP
Pin Count
8
ECCN Code
EAR99
JESD-609 Code
e3
Moisture Sensitivity Level
1
Terminal Finish
MATTE TIN
Compare N74LV74N with alternatives
Compare PI74STEX2G74UEX with alternatives