MX574AKD
vs
ADADC84Z-10
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
DIE
|
DIP
|
| Package Description |
DIE,
|
DIP,
|
| Pin Count |
28
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
25 µs
|
8.4 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-XUUC-N28
|
R-CDIP-T32
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.0122%
|
0.048%
|
| Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
| Negative Supply Voltage-Nom |
-15 V
|
-12 V
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
32
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
BINARY, OFFSET BINARY
|
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIE
|
DIP
|
| Package Equivalence Code |
DIE OR CHIP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Sample and Hold / Track and Hold |
SAMPLE
|
|
| Supply Voltage-Nom |
15 V
|
12 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BICMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
5.72 mm
|
| Terminal Pitch |
|
2.54 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
22.86 mm
|
|
|
|
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