MX23L8111PC-10
vs
K3N4V1000D-DC100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP42,.6
DIP,
Pin Count
42
42
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
100 ns
100 ns
Additional Feature
USER CONFIGURABLE AS 1M X 8
Alternate Memory Width
8
8
JESD-30 Code
R-PDIP-T42
R-PDIP-T42
JESD-609 Code
e0
Length
51.94 mm
52.42 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP42,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.9 mm
5.08 mm
Standby Current-Max
0.00002 A
Supply Current-Max
0.02 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MX23L8111PC-10 with alternatives
Compare K3N4V1000D-DC100 with alternatives