MX23C3211MC-10
vs
K3N6C1000F-GC100
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP44,.63
SOP,
Pin Count
44
44
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
100 ns
100 ns
Additional Feature
WITH PAGE MODE FUNCTION; PAGE MODE ACCESS TIME = 45NS
Alternate Memory Width
8
8
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
JESD-609 Code
e0
Length
28.5 mm
28.5 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX16
2MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP44,.63
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
3.1 mm
Standby Current-Max
0.00005 A
Supply Current-Max
0.06 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
12.6 mm
12.6 mm
Base Number Matches
1
1
Rohs Code
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30
Compare MX23C3211MC-10 with alternatives
Compare K3N6C1000F-GC100 with alternatives