MURS360
vs
BYG60J/T1
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DIODES INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Diodes Incorporated
|
|
| Additional Feature |
LOW LEAKAGE CURRENT
|
|
| Application |
EFFICIENCY
|
FAST SOFT RECOVERY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
| Non-rep Pk Forward Current-Max |
100 A
|
25 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Output Current-Max |
3 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Current-Max |
3 µA
|
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.25 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
C BEND
|
C BEND
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
DO-214AC
|
| Package Description |
|
PLASTIC, SOD-106, 2 PIN
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| JEDEC-95 Code |
|
DO-214AC
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
AVALANCHE
|
|
|
|
Compare MURS360 with alternatives
Compare BYG60J/T1 with alternatives