MTP3N45
vs
RFP3N50
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
HARRIS SEMICONDUCTOR
|
| Package Description |
,
|
FLANGE MOUNT, O-MBFM-P2
|
| Reach Compliance Code |
unknown
|
unknown
|
| Configuration |
Single
|
SINGLE WITH BUILT-IN DIODE
|
| Drain Current-Max (Abs) (ID) |
3 A
|
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
75 W
|
60 W
|
| Surface Mount |
NO
|
NO
|
| Base Number Matches |
4
|
4
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.29.00.95
|
| Case Connection |
|
DRAIN
|
| DS Breakdown Voltage-Min |
|
500 V
|
| Drain Current-Max (ID) |
|
3 A
|
| Drain-source On Resistance-Max |
|
3 Ω
|
| Feedback Cap-Max (Crss) |
|
100 pF
|
| JEDEC-95 Code |
|
TO-204AA
|
| JESD-30 Code |
|
O-MBFM-P2
|
| JESD-609 Code |
|
e0
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
METAL
|
| Package Shape |
|
ROUND
|
| Package Style |
|
FLANGE MOUNT
|
| Power Dissipation Ambient-Max |
|
60 W
|
| Pulsed Drain Current-Max (IDM) |
|
5 A
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
PIN/PEG
|
| Terminal Position |
|
BOTTOM
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
| Turn-off Time-Max (toff) |
|
210 ns
|
| Turn-on Time-Max (ton) |
|
105 ns
|
|
|
|
Compare RFP3N50 with alternatives