MT9173AP1 vs MT8971BE feature comparison

MT9173AP1 Microchip Technology Inc

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MT8971BE Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MITEL SEMICONDUCTOR
Package Description LEAD FREE, PLASTIC, MS-018AB, LCC-28 DIP, DIP22,.4
Reach Compliance Code compliant unknown
JESD-30 Code S-PQCC-J28 R-PDIP-T22
JESD-609 Code e3 e0
Length 11.505 mm
Number of Functions 1 1
Number of Terminals 28 22
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Telecom IC Type DIGITAL SLIC DIGITAL SLIC
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.505 mm
Base Number Matches 3 2
Part Package Code DIP
Pin Count 22
HTS Code 8542.39.00.01
Data Rate 160 Mbps
ISDN Access Rate BASIC
Output High Voltage-Min 2.4 V
Output Low Current-Max 0.005 A
Output Low Voltage-Max 0.4 V
Package Equivalence Code DIP22,.4
Reference Point S
Supply Current-Max 15 mA

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