MT9172AN
vs
MT9173AP1
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SSOP
|
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Data Rate |
144 Mbps
|
|
| ISDN Access Rate |
BASIC
|
|
| JESD-30 Code |
R-PDSO-G24
|
S-PQCC-J28
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output High Voltage-Min |
2.4 V
|
|
| Output Low Voltage-Max |
0.4 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
QCCJ
|
| Package Equivalence Code |
SSOP24,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Point |
S
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.635 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
2
|
3
|
| Package Description |
|
LEAD FREE, PLASTIC, MS-018AB, LCC-28
|
| JESD-609 Code |
|
e3
|
| Length |
|
11.505 mm
|
| Number of Functions |
|
1
|
| Seated Height-Max |
|
4.57 mm
|
| Telecom IC Type |
|
DIGITAL SLIC
|
| Terminal Finish |
|
MATTE TIN
|
| Width |
|
11.505 mm
|
|
|
|
Compare MT9173AP1 with alternatives