MT9171AE
vs
MT8971BPR
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
ZARLINK SEMICONDUCTOR INC
|
| Package Description |
DIP, DIP22,.4
|
QCCJ,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
144 Mbps
|
|
| ISDN Access Rate |
BASIC
|
|
| JESD-30 Code |
R-PDIP-T22
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
27.555 mm
|
11.5062 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
22
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output High Voltage-Min |
2.4 V
|
|
| Output Low Voltage-Max |
0.4 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP22,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Point |
S
|
|
| Seated Height-Max |
5.33 mm
|
4.57 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
DIGITAL SLIC
|
DIGITAL SLIC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
10.16 mm
|
11.5062 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MT9171AE with alternatives
Compare MT8971BPR with alternatives