MT8971BPR
vs
MT9171ANR1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
ZARLINK SEMICONDUCTOR INC
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCJ,
|
5.30 MM WIDTH, LEAD FREE, MO-150AG, SSOP-24
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
e3
|
| Length |
11.5062 mm
|
8.2 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
DIGITAL SLIC
|
DIGITAL SLIC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
11.5062 mm
|
5.3 mm
|
| Base Number Matches |
2
|
3
|
| Data Rate |
|
160 Mbps
|
| ISDN Access Rate |
|
BASIC
|
| Moisture Sensitivity Level |
|
3
|
| Output High Voltage-Min |
|
2.4 V
|
| Output Low Current-Max |
|
0.005 A
|
| Output Low Voltage-Max |
|
0.4 V
|
| Package Equivalence Code |
|
SSOP24,.3
|
| Reference Point |
|
S
|
|
|
|
Compare MT8971BPR with alternatives