MT49H8M36CFM-5IT vs K4C89363AF-GCF60 feature comparison

MT49H8M36CFM-5IT Micron Technology Inc

Buy Now Datasheet

K4C89363AF-GCF60 Samsung Semiconductor

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description MICRO, BGA-144 TBGA,
Pin Count 144 144
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode MULTI BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.5 ns 0.5 ns
Additional Feature AUTO REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e0 e0
Length 18.5 mm 15.5 mm
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR DRAM DDR1 DRAM
Memory Width 36 36
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8MX36 8MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.93 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.9 V 2.625 V
Supply Voltage-Min (Vsup) 1.7 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD SILVER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 10.5 mm
Base Number Matches 1 1
Self Refresh YES

Compare MT49H8M36CFM-5IT with alternatives

Compare K4C89363AF-GCF60 with alternatives