K4C89363AF-GCF60 vs MT49H8M36CFM-5 feature comparison

K4C89363AF-GCF60 Samsung Semiconductor

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MT49H8M36CFM-5 Micron Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TBGA, MICRO, BGA-144
Pin Count 144 144
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.5 ns 0.5 ns
Additional Feature AUTO/SELF REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e0 e0
Length 15.5 mm 18.5 mm
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR1 DRAM DDR DRAM
Memory Width 36 36
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8MX36 8MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 0.93 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.625 V 1.9 V
Supply Voltage-Min (Vsup) 2.375 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 10.5 mm 11 mm
Base Number Matches 1 1

Compare K4C89363AF-GCF60 with alternatives

Compare MT49H8M36CFM-5 with alternatives