MT49H8M36CBM-25
vs
MT49H8M36FM-3.3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LEAD FREE, MICRO, BGA-144
11 X 18.50 MM, MICRO, BGA-144
Pin Count
144
144
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.25 ns
Additional Feature
AUTO REFRESH
AUTO REFRESH
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
JESD-609 Code
e1
e0
Length
18.5 mm
18.5 mm
Memory Density
301989888 bit
301989888 bit
Memory IC Type
DDR DRAM
DDR DRAM
Memory Width
36
36
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
95 °C
Operating Temperature-Min
-40 °C
Organization
8MX36
8MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
VBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.93 mm
0.93 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
11 mm
11 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
300 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA144,12X18,40/32
Sequential Burst Length
2,4,8
Compare MT49H8M36CBM-25 with alternatives
Compare MT49H8M36FM-3.3 with alternatives