MT49H8M36CBM-25 vs MT49H8M36CFM-25 feature comparison

MT49H8M36CBM-25 Micron Technology Inc

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MT49H8M36CFM-25 Micron Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LEAD FREE, MICRO, BGA-144 MICRO, BGA-144
Pin Count 144 144
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.25 ns 0.25 ns
Additional Feature AUTO REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e1 e0
Length 18.5 mm 18.5 mm
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 36 36
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX36 8MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.93 mm 0.93 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 11 mm 11 mm
Base Number Matches 1 1

Compare MT49H8M36CBM-25 with alternatives

Compare MT49H8M36CFM-25 with alternatives