MT29F8G08ABACAWP-IT:CTR vs W29N08GVSJAD feature comparison

MT29F8G08ABACAWP-IT:CTR Micron Technology Inc

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W29N08GVSJAD Winbond Electronics Corp

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Part Life Cycle Code Active Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description TSOP1, TSSOP48,.8,20 ,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Data Retention Time-Min 10
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G48
Length 18.4 mm
Memory Density 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 48
Number of Words 1073741824 words
Number of Words Code 1000000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1GX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3.3 V 3.3 V
Seated Height-Max 1.2 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type SLC NAND TYPE SLC NAND TYPE
Width 12 mm
Write Protection HARDWARE
Base Number Matches 1 1

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Compare W29N08GVSJAD with alternatives