MT28F200B3SG-9B
vs
M29W200BB55N6E
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
TSOP
|
| Package Description |
0.600 INCH, PLASTIC, SOP-44
|
12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48
|
| Pin Count |
44
|
48
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
90 ns
|
55 ns
|
| Additional Feature |
ALSO CONFG AS 128KX16; BOTTOM BOOT BLOCK
|
BOTTOM BOOT BLOCK
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
NO
|
YES
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G48
|
| JESD-609 Code |
e0
|
e3/e6
|
| Length |
28.195 mm
|
20 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
1,2,1,1
|
1,2,1,3
|
| Number of Terminals |
44
|
48
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
128KX16
|
128KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP44,.63
|
TSSOP48,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.7 mm
|
1.2 mm
|
| Sector Size |
16K,8K,96K,128K
|
16K,8K,32K,64K
|
| Standby Current-Max |
0.000005 A
|
0.0001 A
|
| Supply Current-Max |
0.025 mA
|
0.02 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN/TIN BISMUTH
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Toggle Bit |
NO
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
12.6 mm
|
12 mm
|
| Base Number Matches |
1
|
2
|
| Endurance |
|
100000 Write/Erase Cycles
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MT28F200B3SG-9B with alternatives
Compare M29W200BB55N6E with alternatives