MSP430F5310IRGCT vs MSP430F5308IZQER feature comparison

MSP430F5310IRGCT Texas Instruments

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MSP430F5308IZQER Texas Instruments

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code QFN BGA
Package Description GREEN, PLASTIC, VQFN-64 BGA-80
Pin Count 64 80
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Has ADC YES YES
Additional Feature ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
Address Bus Width
Bit Size 16 16
Boundary Scan YES YES
CPU Family MSP430 MSP430
Clock Frequency-Max 32 MHz 32 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-N64 S-PBGA-B80
JESD-609 Code e4 e1
Length 9 mm 5 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of DMA Channels 3 3
Number of External Interrupts
Number of I/O Lines 47 47
Number of Serial I/Os 4 4
Number of Terminals 64 80
Number of Timers 18 18
On Chip Data RAM Width 16 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN VFBGA
Package Equivalence Code LCC64,.35SQ,20 BGA80,9X9,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 6144 6144
RAM (words) 3072 6
ROM (words) 32768 16384
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1 mm
Speed 25 MHz 25 MHz
Supply Current-Max 6.5 mA 6.5 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN SILVER COPPER
Terminal Form NO LEAD BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 9 mm 5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1

Compare MSP430F5310IRGCT with alternatives

Compare MSP430F5308IZQER with alternatives