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MSP430F5308IZQER vs MSP430F5310IZQER feature comparison

MSP430F5308IZQER Texas Instruments

Buy Now Datasheet

MSP430F5310IZQER Texas Instruments

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description BGA-80 BGA-80
Pin Count 80 80
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Has ADC YES YES
Additional Feature ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
Address Bus Width
Bit Size 16 16
Boundary Scan YES YES
CPU Family MSP430 MSP430
Clock Frequency-Max 32 MHz 32 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PBGA-B80 S-PBGA-B80
JESD-609 Code e1 e1
Length 5 mm 5 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of DMA Channels 3 3
Number of External Interrupts
Number of I/O Lines 47 47
Number of Serial I/Os 4 4
Number of Terminals 80 80
Number of Timers 18 18
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA80,9X9,20 BGA80,9X9,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 6144 6144
RAM (words) 6 6
ROM (words) 16384 32768
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1 mm
Speed 25 MHz 25 MHz
Supply Current-Max 6.5 mA 6.5 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5 mm 5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Microcontrollers and Processors » Microcontrollers
Microcontrollers and Processors » Microcontrollers

Compare MSP430F5308IZQER with alternatives

Compare MSP430F5310IZQER with alternatives