MSM832SLMB-10 vs 5962-9318705H5X feature comparison

MSM832SLMB-10 Mosaic Semiconductor Inc

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5962-9318705H5X Mercury Systems Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC MERCURY SYSTEMS INC
Part Package Code DIP
Package Description DIP-28 PGA,
Pin Count 28
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 55 ns
JESD-30 Code R-CDIP-T28 S-CPGA-P66
Memory Density 262144 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 66
Number of Words 32768 words 131072 words
Number of Words Code 32000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 128KX32
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP PGA
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Position DUAL PERPENDICULAR
Base Number Matches 1 1
Rohs Code No
Additional Feature USER CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
JESD-609 Code e4
Length 27.3 mm
Seated Height-Max 4.34 mm
Terminal Finish GOLD
Terminal Pitch 2.54 mm
Width 27.3 mm

Compare MSM832SLMB-10 with alternatives

Compare 5962-9318705H5X with alternatives