MSM534020CRS vs K3N3C1000D-DC100 feature comparison

MSM534020CRS OKI Electric Industry Co Ltd

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K3N3C1000D-DC100 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer OKI ELECTRIC INDUSTRY CO LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 40 40
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 100 ns
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Length 51.98 mm 52.43 mm
Memory Density 67108864 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 4MX16 256KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.065 mA 0.05 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Rohs Code No
Alternate Memory Width 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Temperature Grade COMMERCIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MSM534020CRS with alternatives

Compare K3N3C1000D-DC100 with alternatives