MS1N5313
vs
JANKC1N5313
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
O-LALF-W2
|
DIE-1
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.40
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JEDEC-95 Code |
DO-7
|
|
JESD-30 Code |
O-LALF-W2
|
S-XUUC-N1
|
JESD-609 Code |
e0
|
e0
|
Knee Impedance-Max |
14000 Ω
|
|
Limiting Voltage-Max |
2.75 V
|
2.75 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
1
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Power Dissipation-Max |
0.475 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulation Current-Nom (Ireg) |
4.3 mA
|
4.3 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
NO
|
YES
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UPPER
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
DIE
|
Pin Count |
|
1
|
Reference Standard |
|
MIL-19500/463
|
|
|
|
Compare MS1N5313 with alternatives
Compare JANKC1N5313 with alternatives