JANKC1N5313
vs
JANTX1N5313-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
M/A-COM TECHNOLOGY SOLUTIONS INC
Part Package Code
DIE
Package Description
DIE-1
GLASS PACKAGE-2
Pin Count
1
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.40
8541.10.00.70
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XUUC-N1
O-LALF-W2
JESD-609 Code
e0
Limiting Voltage-Max
2.75 V
2.75 V
Number of Elements
1
1
Number of Terminals
1
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Qualification Status
Not Qualified
Qualified
Reference Standard
MIL-19500/463
MIL-19500
Regulation Current-Nom (Ireg)
4.3 mA
4.3 mA
Rep Pk Reverse Voltage-Max
100 V
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Base Number Matches
2
10
Rohs Code
Additional Feature
HIGH SOURCE IMPEDANCE
Case Connection
ISOLATED
JEDEC-95 Code
DO-7
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Dissipation-Max
0.5 W
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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