JANKC1N5313
vs
1N5313TR
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
CENTRAL SEMICONDUCTOR CORP
|
Part Package Code |
DIE
|
DO-35
|
Package Description |
DIE-1
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Pin Count |
1
|
2
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.40
|
8541.10.00.70
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JESD-30 Code |
S-XUUC-N1
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Limiting Voltage-Max |
2.75 V
|
2.75 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
2
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/463
|
|
Regulation Current-Nom (Ireg) |
4.3 mA
|
4.3 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
YES
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UPPER
|
AXIAL
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Additional Feature |
|
HIGH RELIABILITY
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-35
|
Operating Temperature-Max |
|
200 °C
|
Operating Temperature-Min |
|
-65 °C
|
Power Dissipation-Max |
|
0.6 W
|
|
|
|
Compare JANKC1N5313 with alternatives
Compare 1N5313TR with alternatives