MRF6V2300NB
vs
MRF6V2300NR1
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
FLANGE MOUNT, R-PDFM-F4
FLANGE MOUNT, R-PDFM-F4
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
110 V
110 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
ULTRA HIGH FREQUENCY BAND
ULTRA HIGH FREQUENCY BAND
JEDEC-95 Code
TO-270AA
TO-270
JESD-30 Code
R-PDFM-F4
R-PDFM-F4
Number of Elements
1
1
Number of Terminals
4
4
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
225 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
1
HTS Code
8541.29.00.75
JESD-609 Code
e3
Moisture Sensitivity Level
3
Terminal Finish
TIN
Transistor Application
AMPLIFIER
Compare MRF6V2300NB with alternatives
Compare MRF6V2300NR1 with alternatives