MRF24WN0MB-I/RM
vs
CY15B004J-SXAT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Package Description
ROHS COMPLIANT, MODULE-37
SOIC-8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.32.00.71
JESD-30 Code
R-XXMA-N37
R-PDSO-G8
Length
26.67 mm
4.889 mm
Number of Functions
1
1
Number of Terminals
37
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
XMA
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
SMALL OUTLINE
Seated Height-Max
2.28 mm
1.727 mm
Supply Voltage-Nom
3.3 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
UNSPECIFIED
DUAL
Width
17.78 mm
3.8985 mm
Base Number Matches
1
2
Rohs Code
Yes
ECCN Code
EAR99
Memory Density
4096 bit
Memory IC Type
MEMORY CIRCUIT
Memory Width
8
Moisture Sensitivity Level
3
Number of Words
512 words
Number of Words Code
512
Operating Mode
SYNCHRONOUS
Organization
512X8
Peak Reflow Temperature (Cel)
260
Supply Voltage-Max (Vsup)
3.65 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
Technology
CMOS
Terminal Finish
PURE TIN
Compare MRF24WN0MB-I/RM with alternatives
Compare CY15B004J-SXAT with alternatives