MR750 vs MR750RLG feature comparison

MR750 Micro Commercial Components

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MR750RLG onsemi

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS CORP ON SEMICONDUCTOR
Package Description LEADED BUTTON, 2 PIN O-PADB-W2
Pin Count 2 2
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Application GENERAL PURPOSE GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.9 V 1.25 V
JESD-30 Code O-XADB-W2 O-PADB-W2
JESD-609 Code e0 e3
Non-rep Pk Forward Current-Max 400 A 400 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Output Current-Max 6 A 6 A
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style DISK BUTTON DISK BUTTON
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 50 V 50 V
Reverse Current-Max 25 µA
Surface Mount NO NO
Terminal Finish TIN LEAD TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 6 1
Pbfree Code Yes
Part Package Code Microde Axial
Manufacturer Package Code 194-04
Samacsys Manufacturer onsemi
Operating Temperature-Max 175 °C
Peak Reflow Temperature (Cel) 260
Technology SCHOTTKY

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