MR0A08BCMA35
vs
MR0A08BMYS35
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
EVERSPIN TECHNOLOGIES INC
EVERSPIN TECHNOLOGIES INC
Part Package Code
BGA
TSOP2
Package Description
LFBGA, BGA48,6X8,30
TSOP2,
Pin Count
48
44
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Samacsys Manufacturer
Everspin Technologies
Access Time-Max
35 ns
JESD-30 Code
S-PBGA-B48
R-PDSO-G44
Length
8 mm
18.41 mm
Memory Density
1048576 bit
1024 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
131072 words
128 words
Number of Words Code
128000
128
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
128X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TSOP2
Package Equivalence Code
BGA48,6X8,30
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.35 mm
1.2 mm
Standby Current-Max
0.007 A
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
10.16 mm
Base Number Matches
2
2
Compare MR0A08BCMA35 with alternatives
Compare MR0A08BMYS35 with alternatives