MR0A08BMYS35
vs
MR0A08BMMA35
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
EVERSPIN TECHNOLOGIES INC
EVERSPIN TECHNOLOGIES INC
Part Package Code
TSOP2
BGA
Package Description
TSOP2,
LFBGA,
Pin Count
44
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
R-PDSO-G44
S-PBGA-B48
Length
18.41 mm
8 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
LFBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.35 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
0.75 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
8 mm
Base Number Matches
1
1
Compare MR0A08BMYS35 with alternatives
Compare MR0A08BMMA35 with alternatives