MR0A08BCMA35 vs MR0A08BYS35R feature comparison

MR0A08BCMA35 Everspin Technologies

Buy Now Datasheet

MR0A08BYS35R Everspin Technologies

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer EVERSPIN TECHNOLOGIES INC EVERSPIN TECHNOLOGIES INC
Part Package Code BGA TSOP2
Package Description LFBGA, BGA48,6X8,30 TSOP2, TSOP44,.46,32
Pin Count 48 44
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Samacsys Manufacturer Everspin Technologies Everspin Technologies
Access Time-Max 35 ns 35 ns
JESD-30 Code S-PBGA-B48 R-PDSO-G44
Length 8 mm 18.41 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TSOP2
Package Equivalence Code BGA48,6X8,30 TSOP44,.46,32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.2 mm
Standby Current-Max 0.007 A 0.007 A
Supply Current-Max 0.07 mA 0.065 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 10.16 mm
Base Number Matches 1 1

Compare MR0A08BCMA35 with alternatives

Compare MR0A08BYS35R with alternatives