MPC866PCZP100 vs MCF54450CVM180 feature comparison

MPC866PCZP100 Motorola Mobility LLC

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MCF54450CVM180 Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 60 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 25 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 1.6 mm
Speed 100 MHz 180 MHz
Supply Voltage-Nom 1.8 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer NXP
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 260
Supply Voltage-Max 1.65 V
Supply Voltage-Min 1.35 V
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC866PCZP100 with alternatives

Compare MCF54450CVM180 with alternatives